Atomic Layer Deposition (ALD)

GPTKB entity

Statements (49)
Predicate Object
gptkbp:instanceOf thin film deposition technique
gptkbp:advantage precise thickness control
excellent step coverage
uniformity on complex surfaces
gptkbp:alternativeName atomic layer epitaxy
gptkbp:appliesTo photovoltaics
barrier layers
battery electrodes
catalyst supports
passivation layers
protective coatings
OLED displays
gate dielectrics
gptkbp:characterizedBy self-limiting surface reactions
gptkbp:commonMaterialsDeposited SiO2
Al2O3
ZnO
HfO2
TiO2
gptkbp:developedBy 1970s
gptkbp:enables high aspect ratio coating
multilayer structures
ultrathin film growth
https://www.w3.org/2000/01/rdf-schema#label Atomic Layer Deposition (ALD)
gptkbp:inventedBy gptkb:Tuomo_Suntola
gptkbp:limitation precursor availability
slow deposition rate
thermal budget constraints
gptkbp:precursorType gaseous precursors
inorganic precursors
metal-organic precursors
gptkbp:processor cyclic process
gptkbp:relatedTo gptkb:physical_vapor_deposition
chemical vapor deposition
molecular layer deposition
gptkbp:step precursor exposure
purge step
reactant exposure
second purge step
gptkbp:usedFor precise thickness control
atomic-scale deposition
conformal coating of surfaces
gptkbp:usedIn gptkb:nanotechnology
semiconductor manufacturing
solar cells
energy storage devices
MEMS fabrication
gptkbp:bfsParent gptkb:Chemical_Vapor_Deposition_(CVD)
gptkbp:bfsLayer 6