|
gptkbp:instanceOf
|
gptkb:microprocessor
|
|
gptkbp:architect
|
x86-64
|
|
gptkbp:avionics
|
supported
|
|
gptkbp:competesWith
|
gptkb:AMD_EPYC
|
|
gptkbp:component
|
optimized for
|
|
gptkbp:coolingSystem
|
up to 270W
|
|
gptkbp:customerBase
|
gptkb:LGA_4189
|
|
gptkbp:debutYear
|
2020
|
|
gptkbp:developedBy
|
gptkb:Intel
|
|
gptkbp:drawings
|
Gen 12
|
|
gptkbp:energyEfficiency
|
high
improved
|
|
gptkbp:environmentalImpact
|
80
supported
|
|
gptkbp:features
|
AI acceleration
|
|
gptkbp:formFactor
|
multi-socket
multi-socket configurations
|
|
gptkbp:highestPoint
|
40
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Xeon Ice Lake
|
|
gptkbp:illustrator
|
TensorFlow
|
|
gptkbp:instructionSet
|
x86-64
|
|
gptkbp:is_integrated_with
|
gptkb:Intel_UHD_Graphics
|
|
gptkbp:isAimedAt
|
supported
|
|
gptkbp:isSupportedBy
|
VT-x and VT-d
|
|
gptkbp:keyEvent
|
Intel_Architecture_Day_2020
|
|
gptkbp:launchDate
|
April 2020
|
|
gptkbp:launched
|
2020
|
|
gptkbp:majorRivers
|
64
|
|
gptkbp:market
|
2020
|
|
gptkbp:marketSegment
|
data centers
|
|
gptkbp:offers
|
varies by configuration
|
|
gptkbp:operationalStatus
|
yes
|
|
gptkbp:performance
|
high
improved
high throughput
|
|
gptkbp:productionCompany
|
10nm SuperFin
|
|
gptkbp:RAM
|
6
DDR4
up to 204.8 GB/s
up to 60MB
DDR4, Intel Optane
up to 60MB L3
|
|
gptkbp:releaseDate
|
2020
|
|
gptkbp:security
|
gptkb:Intel_SGX
hardware-based security features
|
|
gptkbp:socialResponsibility
|
3-level cache
|
|
gptkbp:storage
|
up to 6TB
|
|
gptkbp:successor
|
gptkb:Xeon_Sapphire_Rapids
|
|
gptkbp:supports
|
AI workloads
|
|
gptkbp:targetMarket
|
servers
|
|
gptkbp:targets
|
cloud, AI, analytics
|
|
gptkbp:TDP
|
up to 270W
|
|
gptkbp:technology
|
10 nm
|
|
gptkbp:workLocation
|
high-performance computing
|