|
gptkbp:instanceOf
|
gptkb:microprocessor
|
|
gptkbp:architect
|
x86-64
|
|
gptkbp:avionics
|
supported
|
|
gptkbp:compatibleWith
|
included
C620 series
Intel_software_ecosystem
|
|
gptkbp:competesWith
|
gptkb:AMD_EPYC
|
|
gptkbp:coolingSystem
|
up to 350W
|
|
gptkbp:customerBase
|
LGA_4677
|
|
gptkbp:debutYear
|
2022
|
|
gptkbp:designedBy
|
gptkb:Intel
|
|
gptkbp:energyEfficiency
|
improved
|
|
gptkbp:environment
|
included
|
|
gptkbp:environmentalImpact
|
112
supported
|
|
gptkbp:features
|
PCIe 5.0
|
|
gptkbp:formFactor
|
server
2U, 1U, blade
|
|
gptkbp:highestPoint
|
56
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Xeon Sapphire Rapids
|
|
gptkbp:imageStabilization
|
included
|
|
gptkbp:is_integrated_with
|
not included
|
|
gptkbp:isReferencedIn
|
optimized
|
|
gptkbp:isStudiedIn
|
included
|
|
gptkbp:isSupportedBy
|
supported
|
|
gptkbp:keyEvent
|
gptkb:Intel_Innovation_2022
|
|
gptkbp:majorRivers
|
up to 80
|
|
gptkbp:market
|
2022
|
|
gptkbp:marketSegment
|
high-performance computing
|
|
gptkbp:offers
|
varies by configuration
|
|
gptkbp:operationalStatus
|
included
|
|
gptkbp:performance
|
high
improved
optimized for AI workloads
|
|
gptkbp:productionCompany
|
10nm SuperFin
|
|
gptkbp:provides
|
included
|
|
gptkbp:providesServices
|
included
|
|
gptkbp:RAM
|
8
DDR5
up to 204.8 GB/s
up to 105MB
|
|
gptkbp:releaseDate
|
2022
|
|
gptkbp:security
|
included
|
|
gptkbp:successor
|
gptkb:Xeon_Ice_Lake
|
|
gptkbp:supplyChain
|
included
|
|
gptkbp:supported
|
included
|
|
gptkbp:supportRole
|
included
|
|
gptkbp:supports
|
included
|
|
gptkbp:targetMarket
|
data centers
|
|
gptkbp:targets
|
cloud, AI, HPC
|
|
gptkbp:TDP
|
up to 350W
|
|
gptkbp:technology
|
10 nm
|
|
gptkbp:workLocation
|
included
|