Statements (31)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
cost-effective
easy visual inspection of solder joints large footprint compared to BGA limited pin count compared to BGA |
| gptkbp:alternativeTo |
QFP
BGA TQFP |
| gptkbp:feature |
low profile
four-sided leads suitable for high-density PCB mounting |
| gptkbp:hasLeads |
gull-wing
|
| https://www.w3.org/2000/01/rdf-schema#label |
LQFP packages
|
| gptkbp:leadCountRange |
32 to 256
|
| gptkbp:leadPitch |
0.4 mm to 0.8 mm
|
| gptkbp:material |
gptkb:plastic
|
| gptkbp:notableCompany |
gptkb:Texas_Instruments
gptkb:STMicroelectronics gptkb:Microchip_Technology gptkb:NXP_Semiconductors |
| gptkbp:shape |
rectangular
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:standsFor |
gptkb:Low-profile_Quad_Flat_Package
|
| gptkbp:thickness |
1.4 mm
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedFor |
microcontrollers
ASICs memory devices DSPs |
| gptkbp:bfsParent |
gptkb:TQFP_packages
|
| gptkbp:bfsLayer |
7
|