Statements (67)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Manufacturing Process
|
| gptkbp:alsoKnownAs |
Semiconductor Manufacturing
|
| gptkbp:challenge |
Supply Chain Management
Waste Management Energy Consumption Environmental Impact Water Usage Contamination Control Equipment Cost Process Complexity Technological Obsolescence Yield Management |
| gptkbp:criticalFor |
gptkb:Data_Centers
gptkb:artificial_intelligence gptkb:consumer_electronics gptkb:Internet_of_Things Telecommunications Computers Smartphones Industrial Automation Medical Devices Automotive Electronics Electronics Industry Defense Industry |
| gptkbp:hasFeature |
ISO 14644
SEMI Standards |
| gptkbp:historicalPeriod |
First Commercial Fab in 1960s
|
| https://www.w3.org/2000/01/rdf-schema#label |
Semiconductor Fabrication
|
| gptkbp:involves |
gptkb:Deposition
Photolithography Etching Chemical Mechanical Planarization Doping Ion Implantation Metallization Wafer Cleaning |
| gptkbp:notableCompany |
gptkb:Intel
gptkb:Samsung_Electronics gptkb:UMC gptkb:TSMC gptkb:GlobalFoundries gptkb:SMIC |
| gptkbp:output |
Semiconductor Devices
Integrated Circuits Microchips |
| gptkbp:performedAt |
Semiconductor Fabs
|
| gptkbp:performedBy |
Foundries
IDMs |
| gptkbp:requires |
Extreme Cleanliness
High Capital Investment Precision Equipment Skilled Workforce |
| gptkbp:trend |
gptkb:EUV_Lithography
gptkb:Moore's_Law Miniaturization 3D Integration Advanced Packaging Chiplet Design Heterogeneous Integration |
| gptkbp:uses |
Chemicals
Gases Cleanrooms Photoresist Silicon Wafers Ultra-Pure Water |
| gptkbp:bfsParent |
gptkb:Hot-Wall_CVD
|
| gptkbp:bfsLayer |
7
|