Statements (30)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
thermal management challenges
simplified supply chain easier upgrades improved yield signal integrity issues at high speeds |
| gptkbp:alternativeTo |
gptkb:System_in_Package_(SiP)
System on Chip (SoC) |
| gptkbp:consistsOf |
bottom logic package
top memory package |
| gptkbp:enables |
reduced footprint on PCB
vertical stacking of integrated circuits higher component density flexibility in memory and processor combinations separate testing of logic and memory chips |
| https://www.w3.org/2000/01/rdf-schema#label |
PoP (package on package)
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:relatedTo |
3D IC packaging
multi-chip module (MCM) |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:supports |
gptkb:flip_chip_technology
wire bonding |
| gptkbp:usedBy |
gptkb:Apple_A-series_processors
gptkb:Qualcomm_Snapdragon_processors gptkb:Samsung_Exynos_processors |
| gptkbp:usedIn |
smartphones
tablets mobile devices |
| gptkbp:bfsParent |
gptkb:Apple_A6
|
| gptkbp:bfsLayer |
7
|