Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Integrated Circuits
|
| gptkbp:associatedWith |
Cybersecurity Risks
Environmental Concerns Intellectual Property Issues |
| gptkbp:canBe |
gptkb:Dual_In-line_Package
Ball Grid Array Chip-on-Board |
| gptkbp:composedOf |
Silicon
|
| gptkbp:designedFor |
Signal Processing
Data Processing Control_Systems |
| gptkbp:developedBy |
Transistors
|
| gptkbp:faced |
Market Demand
Technological Limitations Supply Chain Issues |
| gptkbp:futurePlans |
More Advanced Versions
|
| gptkbp:hasRelatedPatent |
Aerospace
Artificial Intelligence Telecommunications Industrial Automation Consumer_Electronics |
| https://www.w3.org/2000/01/rdf-schema#label |
Microchips
|
| gptkbp:impact |
Global Economy
Consumer Behavior Technological_Advancement |
| gptkbp:integration |
Actuators
Sensors RFID_Technology |
| gptkbp:isCounteredBy |
Functional Testing
Burn-in Testing Automated_Test_Equipment |
| gptkbp:isUsedFor |
gptkb:Silicon_Carbide
gptkb:Gallium_Arsenide gptkb:Smart_Cards IoT Devices Wearable Devices Organic Materials Newer Technologies |
| gptkbp:isUtilizedFor |
Data_Storage
Digital_Communication Modern_Electronics |
| gptkbp:producedBy |
Semiconductor Companies
|
| gptkbp:produces |
Etching
Photolithography Doping |
| gptkbp:regulates |
Government Agencies
|
| gptkbp:subject |
gptkb:Moore's_Law
|
| gptkbp:usedIn |
Medical Devices
Smartphones Computers Automobiles |