Statements (29)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:personal_computer
|
| gptkbp:abbreviation |
gptkb:HBM2
|
| gptkbp:application |
gptkb:NVIDIA_Tesla_V100
gptkb:AMD_Radeon_Vega_series gptkb:NVIDIA_Quadro_GV100 |
| gptkbp:feature |
low power consumption
high bandwidth 3D-stacked memory through-silicon vias |
| https://www.w3.org/2000/01/rdf-schema#label |
High Bandwidth Memory 2
|
| gptkbp:introducedIn |
2016
|
| gptkbp:JEDECStandard |
gptkb:JESD235B
|
| gptkbp:manufacturer |
gptkb:Samsung
gptkb:Micron_Technology gptkb:SK_Hynix |
| gptkbp:maximumBandwidthPerPin |
2.4 Gbps
|
| gptkbp:maximumBandwidthPerStack |
307 GB/s
|
| gptkbp:maxStackSize |
8 GB
|
| gptkbp:memoryType |
gptkb:SDRAM
|
| gptkbp:predecessor |
gptkb:High_Bandwidth_Memory
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:High_Bandwidth_Memory_3
gptkb:High_Bandwidth_Memory_2E |
| gptkbp:usedIn |
gptkb:AI_accelerators
high-performance computing graphics cards data center applications |
| gptkbp:bfsParent |
gptkb:HBM2
|
| gptkbp:bfsLayer |
6
|