Statements (33)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
memory technology
|
| gptkbp:application |
GPUs
ASICs FPGAs |
| gptkbp:bandwidthPerPin |
2 Gbps to 3.2 Gbps
|
| gptkbp:feature |
low power consumption
high bandwidth 3D stacking through-silicon vias (TSVs) |
| gptkbp:fullName |
gptkb:High_Bandwidth_Memory_2
|
| https://www.w3.org/2000/01/rdf-schema#label |
HBM2 memory
|
| gptkbp:interface |
wide I/O
|
| gptkbp:introduced |
gptkb:JEDEC
|
| gptkbp:introducedIn |
2016
|
| gptkbp:JEDECStandard |
gptkb:JESD235B
|
| gptkbp:maximumBandwidthPerStack |
256 GB/s
|
| gptkbp:maxStackSize |
8 GB
|
| gptkbp:memoryType |
stacked DRAM
|
| gptkbp:notableUser |
gptkb:AMD
gptkb:NVIDIA gptkb:Samsung gptkb:Intel gptkb:SK_Hynix Micron |
| gptkbp:predecessor |
HBM memory
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:successor |
gptkb:HBM2E_memory
|
| gptkbp:usedIn |
gptkb:AI_accelerators
high-performance computing graphics cards data center applications |
| gptkbp:bfsParent |
gptkb:Vega_architecture
|
| gptkbp:bfsLayer |
6
|