High Bandwidth Memory (HBM2)
GPTKB entity
Statements (96)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:memory
|
| gptkbp:capacity |
up to 8 GB per stack
8 GB per stack |
| gptkbp:competes_with |
GDDR6
|
| gptkbp:developed_by |
gptkb:JEDEC
|
| gptkbp:has |
high data transfer rates
multiple memory controllers stacked DRAM chips |
| https://www.w3.org/2000/01/rdf-schema#label |
High Bandwidth Memory (HBM2)
|
| gptkbp:introduced_in |
gptkb:2016
|
| gptkbp:is |
used in gaming consoles
used in data centers used in virtual reality systems a 2nd generation of HBM a high-speed memory interface a key technology for 3 D graphics a key technology for 4 K video processing a key technology for 8 K video processing a key technology for AI workloads a key technology for augmented reality a key technology for autonomous vehicles a key technology for big data analytics a key technology for cloud computing a key technology for edge computing a key technology for high-frequency trading a key technology for machine vision a key technology for real-time data processing a key technology for scientific simulations a type of DRAM designed for bandwidth-intensive applications |
| gptkbp:is_available_in |
multiple configurations
|
| gptkbp:is_compatible_with |
gptkb:PCI_Express
|
| gptkbp:is_designed_for |
data-intensive applications
|
| gptkbp:is_optimized_for |
gptkb:machine_learning
high-performance computing graphics rendering |
| gptkbp:is_part_of |
gptkb:AMD_Vega_architecture
gptkb:AMD_RDNA_architecture gptkb:NVIDIA_Ampere_architecture gptkb:NVIDIA_Turing_architecture gptkb:NVIDIA_Volta_architecture gptkb:Intel_Xe_architecture |
| gptkbp:is_supported_by |
gptkb:CUDA
gptkb:Open_CL |
| gptkbp:is_used_in |
gptkb:wearable_technology
gptkb:virtual_reality gptkb:Astra_Zeneca gptkb:Io_T_devices gptkb:smartphone gptkb:vehicles gptkb:AMD_Radeon_VII gptkb:cloud_computing gptkb:NVIDIA_Tesla_V100 gptkb:machine_learning gptkb:simulation gptkb:NVIDIA_A100 gptkb:drones gptkb:robotics gptkb:FPGA image processing augmented reality cryptocurrency mining data centers deep learning financial modeling gaming consoles tablets computer-aided design (CAD) edge computing smart TVs big data analytics video editing digital signage scientific simulations high-frequency trading AI accelerators render farms 3 D rendering |
| gptkbp:manufacturer |
gptkb:Samsung
gptkb:SK_Hynix gptkb:Micron_Technology |
| gptkbp:offers |
high bandwidth
lower power consumption |
| gptkbp:performance |
lower than GDDR6
|
| gptkbp:provides |
high bandwidth
lower power consumption |
| gptkbp:ram |
256 GB/s
up to 256 GB/s |
| gptkbp:successor |
HBM
|
| gptkbp:supports |
3 D stacking technology
|
| gptkbp:used_by |
supercomputers
|
| gptkbp:used_in |
graphics cards
supercomputers AI accelerators |
| gptkbp:bfsParent |
gptkb:Moto_GP
|
| gptkbp:bfsLayer |
5
|