|
gptkbp:instance_of
|
gptkb:memory
|
|
gptkbp:developed_by
|
gptkb:JEDEC
3 D IC technology
|
|
gptkbp:has
|
increased bandwidth of 819 GB/s
up to 24 GB of memory per stack
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
HBM3
|
|
gptkbp:improves
|
data transfer rates
|
|
gptkbp:increased
|
memory capacity
|
|
gptkbp:is_a_key_component_of
|
Next-gen gaming consoles
|
|
gptkbp:is_adopted_by
|
Leading tech companies
|
|
gptkbp:is_anticipated_by
|
Drive future innovations in computing.
|
|
gptkbp:is_available_in
|
multiple configurations
|
|
gptkbp:is_beneficial_for
|
Virtual reality applications
|
|
gptkbp:is_compared_to
|
DDR5 memory
|
|
gptkbp:is_compatible_with
|
gptkb:AMD_Radeon_graphics
gptkb:PCI_Express_5.0
gptkb:NVIDIA_GPUs
|
|
gptkbp:is_considered_as
|
Future of memory technology
|
|
gptkbp:is_designed_for
|
High-performance computing
|
|
gptkbp:is_effective_against
|
HBM2 E
|
|
gptkbp:is_evaluated_by
|
gptkb:cloud_computing
Supercomputers
|
|
gptkbp:is_expected_to
|
Replace older memory types
|
|
gptkbp:is_integrated_with
|
High-performance workstations
|
|
gptkbp:is_optimized_for
|
Gaming applications
|
|
gptkbp:is_part_of
|
Next-generation memory solutions
Emerging memory technologies
Memory technology family
|
|
gptkbp:is_supported_by
|
Advanced packaging techniques
|
|
gptkbp:is_targeted_at
|
High-end graphics cards
|
|
gptkbp:is_tested_for
|
gptkb:AI_technology
|
|
gptkbp:is_used_for
|
Real-time data processing
|
|
gptkbp:is_used_in
|
Machine learning models
Artificial Intelligence applications
|
|
gptkbp:is_utilized_in
|
Data centers
|
|
gptkbp:manufacturer
|
gptkb:Samsung
gptkb:SK_Hynix
gptkb:Micron_Technology
|
|
gptkbp:offers
|
lower power consumption
|
|
gptkbp:provides
|
higher bandwidth
|
|
gptkbp:released_in
|
gptkb:2021
|
|
gptkbp:speed
|
gptkb:GDDR6_X
|
|
gptkbp:successor
|
HBM2 E
|
|
gptkbp:supports
|
3 D stacking technology
|
|
gptkbp:used_in
|
Graphics Processing Units
|
|
gptkbp:bfsParent
|
gptkb:NVIDIA_H100
|
|
gptkbp:bfsLayer
|
5
|