Statements (19)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:company
|
| gptkbp:country |
gptkb:Taiwan
|
| gptkbp:foundedYear |
1997
|
| gptkbp:headquartersLocation |
gptkb:Hsinchu,_Taiwan
|
| https://www.w3.org/2000/01/rdf-schema#label |
Chipbond Technology
|
| gptkbp:industry |
gptkb:microprocessor
|
| gptkbp:product |
gptkb:COF_(Chip_on_Film)
gptkb:COG_(Chip_on_Glass) IC packaging IC testing LCD driver IC packaging |
| gptkbp:service |
assembly and testing
wafer bumping wafer probing |
| gptkbp:stockExchange |
gptkb:Taiwan_Stock_Exchange
|
| gptkbp:stockSymbol |
6147
|
| gptkbp:website |
https://www.chipbond.com.tw/
|
| gptkbp:bfsParent |
gptkb:Hsinchu_Science_Park
|
| gptkbp:bfsLayer |
6
|