Statements (13)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:alternativeTo |
gptkb:CSP_(Chip_Scale_Package)
COB (Chip on Board) |
| gptkbp:component |
display driver IC modules
|
| gptkbp:enables |
flexible circuit integration
high-density interconnection thin bezel design |
| https://www.w3.org/2000/01/rdf-schema#label |
COF (Chip on Film)
|
| gptkbp:usedIn |
LCD displays
OLED displays |
| gptkbp:uses |
polyimide film substrate
|
| gptkbp:bfsParent |
gptkb:Chipbond_Technology
|
| gptkbp:bfsLayer |
7
|