Statements (17)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:technology
|
| gptkbp:advantage |
reduces assembly cost
reduces module size |
| gptkbp:alternativeTo |
gptkb:COF_(Chip_on_Film)
TAB (Tape Automated Bonding) |
| gptkbp:application |
display modules
|
| gptkbp:component |
semiconductor packaging
|
| gptkbp:enables |
compact display design
|
| gptkbp:feature |
IC mounted directly on glass substrate
|
| https://www.w3.org/2000/01/rdf-schema#label |
COG (Chip on Glass)
|
| gptkbp:usedFor |
industrial equipment
mobile phones portable devices |
| gptkbp:usedIn |
LCD displays
OLED displays |
| gptkbp:bfsParent |
gptkb:Chipbond_Technology
|
| gptkbp:bfsLayer |
7
|