Statements (31)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
integrated circuit technology
|
| gptkbp:advantage |
improved performance
lower power consumption smaller form factor |
| gptkbp:alsoKnownAs |
2.5D integrated circuit
|
| gptkbp:commercialUse |
2010s
|
| gptkbp:component |
silicon interposer
multiple dies package substrate |
| gptkbp:enables |
higher data rates
high bandwidth interconnect heterogeneous integration better thermal management integration of memory and logic chips shorter interconnects |
| gptkbp:example |
AMD Fiji GPU
NVIDIA HBM2 GPUs Xilinx Virtex-7 2000T FPGA |
| https://www.w3.org/2000/01/rdf-schema#label |
2.5D IC
|
| gptkbp:manufacturer |
gptkb:Samsung
gptkb:Intel gptkb:TSMC |
| gptkbp:relatedTo |
gptkb:3D_IC
system-in-package |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
gptkb:AI_accelerators
high-performance computing networking devices |
| gptkbp:uses |
interposer
|
| gptkbp:bfsParent |
gptkb:HBM
|
| gptkbp:bfsLayer |
6
|