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gptkbp:instanceOf
|
gptkb:thermal_management_device
|
|
gptkbp:alternativeTo
|
liquid cooling
|
|
gptkbp:attachedTo
|
gptkb:microprocessor
gptkb:transistor
gptkb:voltage_regulator
|
|
gptkbp:canBe
|
active
passive
liquid cooled
air cooled
|
|
gptkbp:component
|
gptkb:CPU_cooler
gptkb:power_amplifier
gptkb:battery
|
|
gptkbp:improves
|
device reliability
|
|
gptkbp:inventedBy
|
early electronics
|
|
gptkbp:material
|
copper
aluminum
|
|
gptkbp:mayInclude
|
gptkb:fan_convention
fins
|
|
gptkbp:measures
|
thermal resistance (°C/W)
|
|
gptkbp:reduces
|
thermal resistance
|
|
gptkbp:requires
|
thermal interface material
|
|
gptkbp:shape
|
stamped
bonded fin
extruded
folded fin
skived fin
|
|
gptkbp:standardizedBy
|
gptkb:JEDEC
|
|
gptkbp:used_in
|
gptkb:industrial_equipment
data centers
electronics
computers
laptops
servers
LED lighting
gaming consoles
industrial machinery
audio amplifiers
automotive electronics
motherboards
power electronics
solar inverters
graphics cards
battery packs
|
|
gptkbp:usedFor
|
dissipating heat
|
|
gptkbp:worksWith
|
convection
conduction
increasing surface area
|
|
gptkbp:bfsParent
|
gptkb:thermoelectric_cooling
gptkb:thermoelectric_generators
|
|
gptkbp:bfsLayer
|
7
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
heat sink
|