Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
thermal management device
|
| gptkbp:alternativeTo |
liquid cooling
|
| gptkbp:attachedTo |
gptkb:microprocessor
transistor voltage regulator |
| gptkbp:canBe |
active
passive liquid cooled air cooled |
| gptkbp:component |
gptkb:battery
CPU cooler power amplifier |
| https://www.w3.org/2000/01/rdf-schema#label |
heat sink
|
| gptkbp:improves |
device reliability
|
| gptkbp:inventedBy |
early electronics
|
| gptkbp:material |
copper
aluminum |
| gptkbp:mayInclude |
fan convention
fins |
| gptkbp:measures |
thermal resistance (°C/W)
|
| gptkbp:reduces |
thermal resistance
|
| gptkbp:requires |
thermal interface material
|
| gptkbp:shape |
stamped
bonded fin extruded folded fin skived fin |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:used_in |
data centers
electronics industrial equipment computers laptops servers LED lighting gaming consoles industrial machinery audio amplifiers automotive electronics motherboards power electronics solar inverters graphics cards battery packs |
| gptkbp:usedFor |
dissipating heat
|
| gptkbp:worksWith |
convection
conduction increasing surface area |
| gptkbp:bfsParent |
gptkb:thermoelectric_cooling
gptkb:thermoelectric_generators |
| gptkbp:bfsLayer |
7
|