Statements (51)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:abbreviation |
gptkb:WLP
|
| gptkbp:alternativeTo |
wire bonding
flip chip packaging |
| gptkbp:appliesTo |
integrated circuits
|
| gptkbp:developedBy |
late 1990s
|
| gptkbp:enables |
batch processing
lower cost chip-scale packaging higher performance improved thermal performance smaller package size high I/O density shorter electrical paths thin profile packages |
| gptkbp:hasType |
Fan-In WLP
Fan-Out WLP |
| https://www.w3.org/2000/01/rdf-schema#label |
Wafer Level Packaging
|
| gptkbp:manufacturer |
gptkb:ASE_Group
gptkb:ChipMOS gptkb:SPIL gptkb:Apple_Inc. gptkb:Texas_Instruments gptkb:Intel gptkb:Samsung_Electronics gptkb:UMC gptkb:Amkor_Technology gptkb:JCET gptkb:Powertech_Technology_Inc. gptkb:TSMC gptkb:Micron_Technology gptkb:Infineon_Technologies gptkb:GlobalFoundries STATS ChipPAC Huatian Technology Nepes Unimicron |
| gptkbp:partOf |
advanced packaging
|
| gptkbp:usedIn |
gptkb:MEMS
gptkb:consumer_electronics IoT devices mobile devices power management ICs automotive electronics image sensors RF devices |
| gptkbp:uses |
bump technology
redistribution layer wafer fabrication processes |
| gptkbp:bfsParent |
gptkb:WLP
|
| gptkbp:bfsLayer |
8
|