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gptkbp:instanceOf
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gptkb:semiconductor_packaging_technology
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|
gptkbp:abbreviation
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gptkb:WLP
|
|
gptkbp:alternativeTo
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wire bonding
flip chip packaging
|
|
gptkbp:appliesTo
|
integrated circuits
|
|
gptkbp:developedBy
|
late 1990s
|
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gptkbp:enables
|
batch processing
lower cost
chip-scale packaging
higher performance
improved thermal performance
smaller package size
high I/O density
shorter electrical paths
thin profile packages
|
|
gptkbp:hasType
|
Fan-In WLP
Fan-Out WLP
|
|
gptkbp:manufacturer
|
gptkb:ASE_Group
gptkb:ChipMOS
gptkb:SPIL
gptkb:Apple_Inc.
gptkb:Texas_Instruments
gptkb:Intel
gptkb:Samsung_Electronics
gptkb:UMC
gptkb:Amkor_Technology
gptkb:JCET
gptkb:Powertech_Technology_Inc.
gptkb:TSMC
gptkb:Micron_Technology
gptkb:Infineon_Technologies
gptkb:GlobalFoundries
STATS ChipPAC
Huatian Technology
Nepes
Unimicron
|
|
gptkbp:partOf
|
advanced packaging
|
|
gptkbp:usedIn
|
gptkb:MEMS
gptkb:consumer_electronics
IoT devices
mobile devices
power management ICs
automotive electronics
image sensors
RF devices
|
|
gptkbp:uses
|
bump technology
redistribution layer
wafer fabrication processes
|
|
gptkbp:bfsParent
|
gptkb:WLP
|
|
gptkbp:bfsLayer
|
8
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Wafer Level Packaging
|