Wafer-Level Chip-Scale Package
GPTKB entity
Statements (25)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:abbreviation |
gptkb:WLCSP
|
| gptkbp:advantage |
lower cost
smaller footprint better electrical performance improved thermal performance |
| gptkbp:application |
gptkb:consumer_electronics
mobile devices automotive electronics |
| gptkbp:developedBy |
late 1990s
|
| gptkbp:feature |
chip-scale size
no traditional package substrate wafer-level processing |
| https://www.w3.org/2000/01/rdf-schema#label |
Wafer-Level Chip-Scale Package
|
| gptkbp:processor |
bumping
singulation redistribution layer wafer thinning |
| gptkbp:relatedTo |
flip chip
fan-in packaging fan-out packaging |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:usedIn |
integrated circuits
|
| gptkbp:bfsParent |
gptkb:WLCSP
|
| gptkbp:bfsLayer |
6
|