Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:advantage |
smaller footprint
improved electrical performance lower cost for high volume lower profile |
| gptkbp:application |
gptkb:consumer_electronics
mobile devices automotive electronics |
| gptkbp:contrastsWith |
traditional chip-scale package
|
| gptkbp:feature |
direct electrical connection to PCB
no traditional packaging required package size similar to die size |
| https://www.w3.org/2000/01/rdf-schema#label |
WLCSP
|
| gptkbp:limitation |
thermal management challenges
limited I/O count mechanical stress sensitivity |
| gptkbp:standsFor |
gptkb:Wafer-Level_Chip-Scale_Package
|
| gptkbp:step |
wafer singulation
wafer-level bumping wafer-level redistribution layer |
| gptkbp:usedIn |
integrated circuits
|
| gptkbp:bfsParent |
gptkb:STM32
|
| gptkbp:bfsLayer |
5
|