gptkbp:instanceOf
|
patent
|
gptkbp:covers
|
semiconductor manufacturing
|
gptkbp:hasAbstract
|
A method for producing a semiconductor device.
|
gptkbp:hasAssignee
|
gptkb:Tech_Innovations_Inc.
|
gptkbp:hasClaim
|
10
4.
3.
5.
2.
6.
1.
7.
8.
10.
9.
|
gptkbp:hasCountry
|
gptkb:USA
|
gptkbp:hasDescription
|
This patent describes a method for producing semiconductor devices.
|
gptkbp:hasExaminer
|
Jane_Smith
|
gptkbp:hasFacility
|
a new method for device fabrication.
|
gptkbp:hasFieldOfUse
|
electronics
integrated circuits
|
gptkbp:hasFilingDate
|
2000-01-01
|
gptkbp:hasInternationalClassification
|
H01L
|
gptkbp:hasInventor
|
gptkb:John_Doe
|
gptkbp:hasLegalEvent
|
patent granted
|
gptkbp:hasLegalStatus
|
active
|
gptkbp:hasPatentNumber
|
10
|
gptkbp:hasPriorityDate
|
2000-01-01
1999-01-01
|
gptkbp:hasPublications
|
2000-01-01
|
gptkbp:hasRelatedPatent
|
gptkb:US_0000015_B2
|
gptkbp:hasTechnicalField
|
semiconductor fabrication
|
gptkbp:hasTechnology
|
improving semiconductor yield
|
gptkbp:hasTitle
|
Method for producing a semiconductor device
|
https://www.w3.org/2000/01/rdf-schema#label
|
US 0000010 B2
|
gptkbp:inventiveStep
|
yes
|
gptkbp:isAssignedTo
|
gptkb:Tech_Innovations_Inc.
|
gptkbp:isCitedBy
|
gptkb:US_0000011_B2
|
gptkbp:isCitedIn
|
gptkb:US_0000013_B2
|
gptkbp:isExaminedBy
|
gptkb:USPTO
|
gptkbp:isFiledIn
|
gptkb:United_States
|
gptkbp:isFiledUnder
|
gptkb:Tech_Innovations_Inc.
utility patent
Class 257
|
gptkbp:isGranted
|
true
|
gptkbp:isInFamilyWith
|
gptkb:US_0000012_B2
|
gptkbp:isPartOf
|
gptkb:US_0000001_B2
semiconductor technology
|
gptkbp:isPublishedIn
|
gptkb:US_2000/0000010_A1
USPTO database
|
gptkbp:isReferencedBy
|
gptkb:US_0000014_B2
|
gptkbp:isRelatedTo
|
gptkb:US_0000009_B2
|
gptkbp:isSubjectTo
|
US_patent_law
|
gptkbp:numberOfFigures
|
5
|
gptkbp:pageCount
|
20
|
gptkbp:usesTechnology
|
microelectronics
|