|
gptkbp:instanceOf
|
patent
|
|
gptkbp:filingCountry
|
gptkb:US
|
|
gptkbp:hasAbstract
|
A method for making a semiconductor device.
|
|
gptkbp:hasApplicationNumber
|
09/123,456
|
|
gptkbp:hasAssignee
|
gptkb:IBM
gptkb:International_Business_Machines_Corporation
|
|
gptkbp:hasCitedPatent
|
gptkb:US_0000012_B2
|
|
gptkbp:hasClaim
|
20
|
|
gptkbp:hasCountry
|
09/123,456
|
|
gptkbp:hasDescription
|
Describes a process for fabricating semiconductor devices.
|
|
gptkbp:hasExaminer
|
Jane_Smith
|
|
gptkbp:hasFieldOfUse
|
electronics
electronics manufacturing
|
|
gptkbp:hasFilingDate
|
2000-01-10
|
|
gptkbp:hasInternationalClassification
|
H01L
|
|
gptkbp:hasInventor
|
gptkb:John_Doe
|
|
gptkbp:hasJurisdictionOver
|
gptkb:United_States
|
|
gptkbp:hasLegalEvent
|
patent granted
|
|
gptkbp:hasLegalStatus
|
active
|
|
gptkbp:hasMember
|
gptkb:US_0000014_B2
|
|
gptkbp:hasPatentNumber
|
gptkb:US_0000013_B2
|
|
gptkbp:hasPriorityDate
|
2020-01-10
1999-01-10
|
|
gptkbp:hasPrograms
|
gptkb:US_0000016_B2
|
|
gptkbp:hasPublications
|
B2
2000-07-18
|
|
gptkbp:hasRelatedPatent
|
gptkb:US_2000/0000013_A1
gptkb:US_0000017_B2
utility patent
|
|
gptkbp:hasTechnicalField
|
semiconductor technology
|
|
gptkbp:hasTechnology
|
A detailed description of the semiconductor device fabrication process.
|
|
gptkbp:hasTitle
|
Method of making a semiconductor device
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
US 0000013 B2
|
|
gptkbp:isAssignedTo
|
gptkb:IBM
|
|
gptkbp:isBasedOn
|
gptkb:USPTO
|
|
gptkbp:isCitedBy
|
gptkb:US_0000014_B2
true
|
|
gptkbp:isCitedIn
|
gptkb:US_0000018_B2
|
|
gptkbp:isFiledIn
|
gptkb:United_States
|
|
gptkbp:isFiledUnder
|
Class 438
H01L_21/01
|
|
gptkbp:isGranted
|
true
|
|
gptkbp:isInFamilyWith
|
semiconductors
US_0000013_family
|
|
gptkbp:isPartOf
|
H01L 21/00
patent family
|
|
gptkbp:isPublishedIn
|
gptkb:US_0000013_B2
USPTO database
|
|
gptkbp:isReferencedBy
|
gptkb:US_0000015_B2
|
|
gptkbp:isRelatedTo
|
semiconductor devices
|
|
gptkbp:usesTechnology
|
semiconductor technology
semiconductor manufacturing
|