Statements (20)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
smaller footprint
improved electrical performance higher pin density |
| gptkbp:ballPitch |
typically less than 0.5 mm
|
| gptkbp:category |
chip packaging
|
| gptkbp:contrastsWith |
gptkb:FBGA_(Fine-pitch_Ball_Grid_Array)
|
| gptkbp:feature |
very fine ball pitch
|
| https://www.w3.org/2000/01/rdf-schema#label |
UFBGA
|
| gptkbp:mountingMethod |
solder balls on underside
|
| gptkbp:shape |
rectangular or square
|
| gptkbp:standsFor |
gptkb:Ultra_Fine-pitch_Ball_Grid_Array
|
| gptkbp:type |
gptkb:BGA_(Ball_Grid_Array)
|
| gptkbp:usedFor |
surface-mount technology
|
| gptkbp:usedIn |
microcontrollers
semiconductor devices mobile devices memory chips |
| gptkbp:bfsParent |
gptkb:STM32
|
| gptkbp:bfsLayer |
5
|