Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor process node
|
| gptkbp:announced |
2019
|
| gptkbp:basedOn |
TSMC N7
|
| gptkbp:compatibleWith |
N7 design rules
|
| gptkbp:developedBy |
gptkb:TSMC
|
| gptkbp:EUVLayers |
single EUV layer
|
| https://www.w3.org/2000/01/rdf-schema#label |
TSMC N6
|
| gptkbp:lithography |
gptkb:EUV
DUV |
| gptkbp:massProductionStart |
2020
|
| gptkbp:predecessor |
gptkb:TSMC_N5
|
| gptkbp:processor |
6nm process
|
| gptkbp:successor |
TSMC N7
|
| gptkbp:targetMarket |
gptkb:consumer_electronics
automotive mobile |
| gptkbp:transistorDensityIncrease |
18% over N7
|
| gptkbp:usedFor |
AI chips
SoCs 5G chips |
| gptkbp:bfsParent |
gptkb:Arc_GPU
gptkb:Intel_Arc |
| gptkbp:bfsLayer |
6
|