|
gptkbp:instanceOf
|
Dynamic random-access memory
|
|
gptkbp:exportedTo
|
Worldwide
|
|
gptkbp:hasFeature
|
High density
High bandwidth
Low power consumption
Advanced process technology
|
|
gptkbp:hasType
|
gptkb:DDR
gptkb:SDRAM
gptkb:DDR2
gptkb:DDR5
gptkb:HBM
gptkb:GDDR
gptkb:DDR4
DDR3
|
|
gptkbp:headquarters
|
gptkb:Suwon,_South_Korea
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Samsung DRAM
|
|
gptkbp:introducedIn
|
1983
|
|
gptkbp:manufacturer
|
gptkb:Samsung_Electronics
|
|
gptkbp:market
|
Largest DRAM manufacturer globally (as of 2023)
|
|
gptkbp:notableClient
|
gptkb:Apple
gptkb:HP
gptkb:AMD
gptkb:Dell
gptkb:Lenovo
gptkb:NVIDIA
|
|
gptkbp:notableCompetitor
|
gptkb:Micron_Technology
gptkb:SK_Hynix
|
|
gptkbp:parentCompany
|
gptkb:Samsung_Group
|
|
gptkbp:productType
|
gptkb:Samsung_Semiconductor
|
|
gptkbp:technology
|
Semiconductor memory
|
|
gptkbp:usedIn
|
Computers
Servers
Smartphones
Tablets
Graphics cards
|
|
gptkbp:website
|
https://semiconductor.samsung.com/dram/
|
|
gptkbp:bfsParent
|
gptkb:Samsung_Electronics_Device_Solutions_Division
|
|
gptkbp:bfsLayer
|
7
|