SPI (Solder Paste Inspection)
GPTKB entity
Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
inspection technology
|
| gptkbp:alternativeTo |
manual inspection
|
| gptkbp:appliesTo |
printed circuit boards
|
| gptkbp:detects |
solder paste area
solder paste height solder paste position solder paste shape solder paste volume |
| https://www.w3.org/2000/01/rdf-schema#label |
SPI (Solder Paste Inspection)
|
| gptkbp:improves |
manufacturing yield
|
| gptkbp:measures |
solder paste alignment
solder paste bridging |
| gptkbp:occursAfter |
solder paste printing
|
| gptkbp:precededBy |
component placement
|
| gptkbp:purpose |
inspect solder paste deposits
|
| gptkbp:reduces |
defects
|
| gptkbp:relatedTo |
gptkb:AOI_(Automated_Optical_Inspection)
X-ray inspection |
| gptkbp:technology |
3D imaging
2D imaging |
| gptkbp:usedIn |
electronics manufacturing
|
| gptkbp:bfsParent |
gptkb:SQ3000_Multi-Function_System
|
| gptkbp:bfsLayer |
8
|