|
gptkbp:instance_of
|
gptkb:microprocessor
|
|
gptkbp:bfsLayer
|
4
|
|
gptkbp:bfsParent
|
gptkb:SPARC_Architecture
|
|
gptkbp:architectural_style
|
gptkb:SPARC_V9
|
|
gptkbp:cache_size
|
L1, L2, L3 cache
up to 32 MB
|
|
gptkbp:competes_with
|
gptkb:railway_line
|
|
gptkbp:designed_by
|
gptkb:Database_Management_System
|
|
gptkbp:features
|
hardware multithreading
integrated security features
|
|
gptkbp:form_factor
|
rack-mounted
|
|
gptkbp:frequency
|
up to 3.6 G Hz
|
|
gptkbp:has
|
high memory bandwidth
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
SPARC S11
|
|
gptkbp:integrates_with
|
Oracle software solutions
|
|
gptkbp:introduced
|
gptkb:Oracle_Open_World_2012
|
|
gptkbp:is_aimed_at
|
large enterprises
|
|
gptkbp:is_available_in
|
various configurations
multiple core counts
|
|
gptkbp:is_compatible_with
|
gptkb:Oracle_VM
gptkb:Solaris_operating_system
|
|
gptkbp:is_designed_for
|
data centers
mission-critical applications
high-performance workloads
|
|
gptkbp:is_enhanced_by
|
Oracle Solaris features
|
|
gptkbp:is_known_for
|
energy efficiency
|
|
gptkbp:is_optimized_for
|
enterprise applications
|
|
gptkbp:is_part_of
|
gptkb:SPARC_family_of_processors
Oracle's SPARC server lineup
|
|
gptkbp:is_used_in
|
gptkb:financial_services_company
supercomputers
|
|
gptkbp:language_of_instruction
|
gptkb:SPARC
|
|
gptkbp:manufacturer
|
gptkb:Database_Management_System
32nm process technology
|
|
gptkbp:market_segment
|
high-performance computing
|
|
gptkbp:notable_for
|
high reliability
|
|
gptkbp:offers
|
high scalability
|
|
gptkbp:performance
|
up to 16 cores
|
|
gptkbp:power_consumption
|
up to 200 watts
|
|
gptkbp:price
|
varied by configuration
|
|
gptkbp:provides
|
high availability
high throughput
|
|
gptkbp:ram
|
up to 1 TB
|
|
gptkbp:release_year
|
gptkb:2012
|
|
gptkbp:socket_type
|
gptkb:SPARC_S3
|
|
gptkbp:successor
|
gptkb:SPARC_S12
|
|
gptkbp:supports
|
64-bit computing
big data analytics
cloud computing environments
large-scale applications
ECC memory
|
|
gptkbp:target_market
|
enterprise servers
|
|
gptkbp:thermal_design_power
|
up to 200 W
|
|
gptkbp:uses
|
multi-core technology
CMOS technology
advanced manufacturing processes
|
|
gptkbp:utilizes
|
advanced cooling technologies
|
|
gptkbp:virtualization_support
|
gptkb:battle
|