SOI CMOS

GPTKB entity

Statements (55)
Predicate Object
gptkbp:instanceOf computer
gptkbp:associated_with high-voltage applications
gptkbp:benefits RF applications
high-frequency applications
gptkbp:compatibleWith bulk_CMOS_processes
gptkbp:electionYear 3D integration
flexible electronics
gptkbp:enables higher speed operation
gptkbp:enhances scalability of devices
gptkbp:explores gptkb:quantum_computing
sensors and actuators
gptkbp:features mobile devices
smart devices
gptkbp:has_a_focus_on research and development
industry standards
nanotechnology research
https://www.w3.org/2000/01/rdf-schema#label SOI CMOS
gptkbp:improves device isolation
gptkbp:is_a integrated circuit technology
gptkbp:is_a_key_component_of data centers
gptkbp:is_a_popular_spot_for high-density integration
gptkbp:is_a_subject_of patent filings
gptkbp:is_a_time_for energy-efficient designs
power-sensitive designs
gptkbp:is_available_in automotive applications
gptkbp:is_characterized_by high integration density
thin silicon layer
gptkbp:is_evaluated_by low-power designs
gptkbp:is_integrated_with MEMS_technology
gptkbp:is_known_for high reliability
reduced parasitic capacitance
gptkbp:is_part_of smart grid technology
semiconductor technology
advanced packaging solutions
next-generation electronics
gptkbp:is_recognized_for telecommunications devices
gptkbp:is_studied_in future electronics
gptkbp:is_used_in IoT devices
consumer electronics
wearable technology
analog circuits
digital circuits
microprocessors
high-speed data processing
low-voltage applications
high-performance circuits
gptkbp:offers better thermal performance
gptkbp:producedBy wafer bonding
gptkbp:produces semiconductor companies
advanced semiconductor devices
gptkbp:provides lower power consumption
gptkbp:reduces short-channel effects
gptkbp:relatedTo gptkb:bulk_CMOS
gptkbp:suitableFor memory devices
gptkbp:uses Silicon-on-Insulator