Statements (55)
Predicate | Object |
---|---|
gptkbp:instanceOf |
computer
|
gptkbp:associated_with |
high-voltage applications
|
gptkbp:benefits |
RF applications
high-frequency applications |
gptkbp:compatibleWith |
bulk_CMOS_processes
|
gptkbp:electionYear |
3D integration
flexible electronics |
gptkbp:enables |
higher speed operation
|
gptkbp:enhances |
scalability of devices
|
gptkbp:explores |
gptkb:quantum_computing
sensors and actuators |
gptkbp:features |
mobile devices
smart devices |
gptkbp:has_a_focus_on |
research and development
industry standards nanotechnology research |
https://www.w3.org/2000/01/rdf-schema#label |
SOI CMOS
|
gptkbp:improves |
device isolation
|
gptkbp:is_a |
integrated circuit technology
|
gptkbp:is_a_key_component_of |
data centers
|
gptkbp:is_a_popular_spot_for |
high-density integration
|
gptkbp:is_a_subject_of |
patent filings
|
gptkbp:is_a_time_for |
energy-efficient designs
power-sensitive designs |
gptkbp:is_available_in |
automotive applications
|
gptkbp:is_characterized_by |
high integration density
thin silicon layer |
gptkbp:is_evaluated_by |
low-power designs
|
gptkbp:is_integrated_with |
MEMS_technology
|
gptkbp:is_known_for |
high reliability
reduced parasitic capacitance |
gptkbp:is_part_of |
smart grid technology
semiconductor technology advanced packaging solutions next-generation electronics |
gptkbp:is_recognized_for |
telecommunications devices
|
gptkbp:is_studied_in |
future electronics
|
gptkbp:is_used_in |
IoT devices
consumer electronics wearable technology analog circuits digital circuits microprocessors high-speed data processing low-voltage applications high-performance circuits |
gptkbp:offers |
better thermal performance
|
gptkbp:producedBy |
wafer bonding
|
gptkbp:produces |
semiconductor companies
advanced semiconductor devices |
gptkbp:provides |
lower power consumption
|
gptkbp:reduces |
short-channel effects
|
gptkbp:relatedTo |
gptkb:bulk_CMOS
|
gptkbp:suitableFor |
memory devices
|
gptkbp:uses |
Silicon-on-Insulator
|