gptkbp:instance_of
|
gptkb:System_on_Chip
|
gptkbp:ai_accelerator
|
NPU
|
gptkbp:application
|
AI, multimedia, and edge computing
|
gptkbp:architecture
|
gptkb:ARM
|
gptkbp:average_temperature
|
-40 to 85 ° C
|
gptkbp:compatibility
|
gptkb:Linux
gptkb:Android
|
gptkbp:features
|
4 K video decoding
|
gptkbp:form_factor
|
BGA
|
gptkbp:gpu
|
Mali-T860 MP4
|
https://www.w3.org/2000/01/rdf-schema#label
|
Rockchip RK3399 Pro
|
gptkbp:interface
|
gptkb:Gigabit_Ethernet
gptkb:I2_C
gptkb:UART
SPI
USB 3.0
PCIe 2.0
|
gptkbp:is_a_platform_for
|
gptkb:RK3399_Pro_development_board
|
gptkbp:manufacturer
|
gptkb:Rockchip_Electronics
|
gptkbp:manufacturing_process
|
10 nm
|
gptkbp:market_segment
|
Consumer electronics
Industrial applications
|
gptkbp:memory_type
|
gptkb:LPDDR4
|
gptkbp:number_of_cores
|
gptkb:6
|
gptkbp:performance
|
High performance for AI tasks
High performance for multimedia tasks
|
gptkbp:power_consumption
|
< 5 W
|
gptkbp:ram
|
4 GB
|
gptkbp:release_date
|
gptkb:2017
|
gptkbp:release_year
|
gptkb:2017
|
gptkbp:sound
|
HDMI audio
I2 S
|
gptkbp:successor
|
gptkb:Rockchip_RK3588
|
gptkbp:thermal_design_power
|
Passive cooling
|
gptkbp:video_output
|
gptkb:H.264
gptkb:HDMI_2.0
H.265
|
gptkbp:bfsParent
|
gptkb:Power_VR_Series_6
|
gptkbp:bfsLayer
|
7
|