gptkbp:instance_of
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gptkb:memory
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gptkbp:application
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gptkb:smartphone
Laptops
Tablets
Wearable Devices
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gptkbp:data_usage
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up to 4266 MT/s
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gptkbp:developed_by
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gptkb:JEDEC
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gptkbp:features
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Low power consumption
High performance
Improved thermal performance
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https://www.w3.org/2000/01/rdf-schema#label
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LPDDR4
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gptkbp:input_output
|
1.1 V
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gptkbp:interface
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16-bit
32-bit
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gptkbp:introduced_in
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gptkb:2014
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gptkbp:is_standardized_by
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gptkb:JEDEC_JESD209-4
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gptkbp:manufacturer
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gptkb:Nanya_Technology
gptkb:Samsung
gptkb:SK_Hynix
gptkb:Micron_Technology
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gptkbp:market
|
gptkb:Consumer_Electronics
gptkb:Virtual_Reality_Devices
Automotive
Gaming Consoles
Io T Devices
|
gptkbp:memory_density
|
Higher than LPDDR3
Lower than LPDDR5
|
gptkbp:memory_type
|
gptkb:SRAM
|
gptkbp:performance
|
Higher than LPDDR3
Lower latency than LPDDR3
|
gptkbp:predecessor
|
gptkb:LPDDR2
|
gptkbp:ram
|
up to 16 GB
up to 34.1 GB/s
|
gptkbp:related_to
|
gptkb:LPDDR5
gptkb:Synchronous_Dynamic_RAM
gptkb:SRAM
DDR3
DDR4
|
gptkbp:release_date
|
gptkb:2014
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gptkbp:successor
|
gptkb:LPDDR3
|
gptkbp:technology
|
Multi-Channel Architecture
On-die ECC
3 D stacking
|
gptkbp:used_in
|
gptkb:mobile_devices
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gptkbp:bfsParent
|
gptkb:NVIDIA_Tegra_X1
gptkb:Qualcomm_Snapdragon_810_Plus
gptkb:SK_Hynix
|
gptkbp:bfsLayer
|
5
|