Physical Vapor Deposition Methods
GPTKB entity
Statements (27)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
thin film deposition technique
|
| gptkbp:advantage |
precise thickness control
high purity films good adhesion requires vacuum equipment line-of-sight deposition |
| gptkbp:canBeDeployedOn |
gptkb:ceramics
metals semiconductors alloys |
| https://www.w3.org/2000/01/rdf-schema#label |
Physical Vapor Deposition Methods
|
| gptkbp:includes |
evaporation
molecular beam epitaxy sputtering arc vapor deposition |
| gptkbp:operatesIn |
low pressure
|
| gptkbp:processor |
vacuum process
|
| gptkbp:relatedTo |
Chemical Vapor Deposition Methods
|
| gptkbp:requires |
substrate
source material |
| gptkbp:usedFor |
surface modification
creating thin films |
| gptkbp:usedIn |
microelectronics
semiconductor manufacturing coating technology |
| gptkbp:bfsParent |
gptkb:Hot-Wall_CVD
|
| gptkbp:bfsLayer |
7
|