Statements (13)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:alternativeTo |
surface-mount technology
wire bonding |
| gptkbp:enables |
cost-effective mass production
high-density mounting of integrated circuits |
| https://www.w3.org/2000/01/rdf-schema#label |
Chip-on-board
|
| gptkbp:involves |
attaching bare semiconductor dies directly to a printed circuit board
|
| gptkbp:provides |
improved thermal performance
reduced package size |
| gptkbp:usedIn |
LED lighting
electronics manufacturing |
| gptkbp:bfsParent |
gptkb:Multi-Chip_Module
|
| gptkbp:bfsLayer |
7
|