Micro-Electro-Mechanical Systems
GPTKB entity
Statements (50)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:technology
|
| gptkbp:abbreviation |
gptkb:MEMS
|
| gptkbp:application |
biosensors
accelerometers actuators gyroscopes sensors inkjet printer heads pressure sensors microphones optical switches |
| gptkbp:component |
microelectronics
microactuators microsensors micromechanics |
| gptkbp:fabricationProcess |
gptkb:engraver
deposition doping photolithography wafer bonding |
| gptkbp:feature |
batch fabrication
high sensitivity low cost low power consumption miniaturization integration of mechanical and electrical components |
| gptkbp:field |
gptkb:nanotechnology
microtechnology |
| https://www.w3.org/2000/01/rdf-schema#label |
Micro-Electro-Mechanical Systems
|
| gptkbp:material |
gptkb:ceramics
metals polymers silicon |
| gptkbp:originatedIn |
1980s
|
| gptkbp:relatedStandard |
gptkb:IEEE_1076.1
gptkb:ISO/TS_80004-8 |
| gptkbp:relatedTo |
gptkb:NEMS
gptkb:Lab-on-a-chip semiconductor devices microfluidics microfabrication microsystems |
| gptkbp:usedIn |
gptkb:consumer_electronics
aerospace automotive industry industrial automation telecommunications medical devices |
| gptkbp:bfsParent |
gptkb:MEMS
|
| gptkbp:bfsLayer |
5
|