Statements (27)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
integrated circuit packaging technology
|
| gptkbp:abbreviation |
gptkb:LGA
|
| gptkbp:advantage |
reduced risk of bent pins
higher pin density |
| gptkbp:component |
surface-mount
|
| gptkbp:contactLocation |
bottom of the package
|
| https://www.w3.org/2000/01/rdf-schema#label |
Land Grid Array (LGA)
|
| gptkbp:introducedIn |
early 2000s
|
| gptkbp:mountingMethod |
socket
|
| gptkbp:notableExample |
gptkb:LGA_1700
gptkb:LGA_1151 gptkb:LGA_1200 gptkb:LGA_775 |
| gptkbp:phoneNumber |
flat contacts
|
| gptkbp:relatedTo |
gptkb:Ball_Grid_Array_(BGA)
gptkb:Pin_Grid_Array_(PGA) |
| gptkbp:replacedBy |
gptkb:Pin_Grid_Array_(PGA)
|
| gptkbp:socketContactType |
spring-loaded pins
|
| gptkbp:usedBy |
gptkb:AMD
gptkb:Intel |
| gptkbp:usedFor |
mounting microprocessors
|
| gptkbp:usedIn |
servers
workstations desktop computers motherboards |
| gptkbp:bfsParent |
gptkb:Socket_SP3
|
| gptkbp:bfsLayer |
6
|