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gptkbp:instance_of
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gptkb:automobile
|
|
gptkbp:bfsLayer
|
5
|
|
gptkbp:bfsParent
|
gptkb:Socket_604
|
|
gptkbp:allows
|
easy CPU replacement
|
|
gptkbp:benefits
|
power delivery
|
|
gptkbp:developed_by
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gptkb:Intel
|
|
gptkbp:features
|
grid of pins
|
|
gptkbp:first_introduced
|
gptkb:2004
|
|
gptkbp:has_variants
|
gptkb:LGA_1151
gptkb:LGA_775
LGA 2066
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
LGA (Land Grid Array)
|
|
gptkbp:is_associated_with
|
high thermal performance
|
|
gptkbp:is_available_in
|
various sizes
|
|
gptkbp:is_compatible_with
|
cooling solutions
various operating systems
socket types
various chipsets
|
|
gptkbp:is_considered
|
a standard
a reliable connection method
|
|
gptkbp:is_designed_for
|
high-speed data transfer
socketed CP Us
|
|
gptkbp:is_known_for
|
ease of installation
reduced risk of bent pins
|
|
gptkbp:is_often_used_in
|
gptkb:Intel_processors
gptkb:AMD_processors
|
|
gptkbp:is_part_of
|
gptkb:architect
gptkb:microprocessor
gptkb:computer
hardware design
socket family
CPU packaging technology
|
|
gptkbp:is_related_to
|
gptkb:BGA_(Ball_Grid_Array)
gptkb:PGA_(Pin_Grid_Array)
|
|
gptkbp:is_supported_by
|
chipset manufacturers
|
|
gptkbp:is_tested_for
|
thermal performance
electrical performance
mechanical stability
|
|
gptkbp:is_used_for
|
overclocking
|
|
gptkbp:is_used_in
|
gptkb:server
data centers
motherboards
workstations
virtualization environments
gaming P Cs
|
|
gptkbp:is_utilized_in
|
embedded systems
AI applications
|
|
gptkbp:manufacturer
|
various companies
|
|
gptkbp:provides
|
better electrical contact
|
|
gptkbp:suitable_for
|
enthusiasts
high-performance computing
|
|
gptkbp:supports
|
multiple CPU cores
|
|
gptkbp:used_in
|
computer processors
|