Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
integrated circuit packaging
|
| gptkbp:abbreviation |
Land Grid Array
|
| gptkbp:advantage |
better electrical performance
reduced risk of bent pins |
| gptkbp:feature |
flat contacts on the bottom of the package
|
| https://www.w3.org/2000/01/rdf-schema#label |
LGA (Land Grid Array)
|
| gptkbp:introducedIn |
1990s
|
| gptkbp:mountingMethod |
socket
surface mount |
| gptkbp:notableExample |
gptkb:LGA_1700
gptkb:LGA_1151 gptkb:LGA_1200 |
| gptkbp:phoneNumber |
lands
|
| gptkbp:replacedBy |
gptkb:Pin_Grid_Array_(PGA)
|
| gptkbp:usedBy |
gptkb:AMD
gptkb:Intel |
| gptkbp:usedFor |
mounting integrated circuits
mounting microprocessors |
| gptkbp:usedIn |
embedded systems
server CPUs desktop CPUs |
| gptkbp:bfsParent |
gptkb:LGA_2066
|
| gptkbp:bfsLayer |
5
|