Intel's 3 D stacking technology
GPTKB entity
Statements (63)
| Predicate | Object |
|---|---|
| gptkbp:instance_of |
gptkb:technology
|
| gptkbp:applies_to |
memory chips
logic chips |
| gptkbp:budget |
enhance competitiveness
drive innovation grow in adoption |
| gptkbp:challenges |
thermal management
cost implications manufacturing complexity |
| gptkbp:developed_by |
gptkb:Intel_Corporation
|
| gptkbp:enables |
higher density
|
| gptkbp:enhances |
bandwidth
|
| https://www.w3.org/2000/01/rdf-schema#label |
Intel's 3 D stacking technology
|
| gptkbp:improves |
gptkb:performance
|
| gptkbp:innovation |
chip design
|
| gptkbp:is_a |
vertical integration technique
|
| gptkbp:is_adopted_by |
leading tech companies
|
| gptkbp:is_based_on |
through-silicon vias (TSVs)
|
| gptkbp:is_beneficial_for |
gptkb:mobile_devices
automotive applications consumer electronics |
| gptkbp:is_compared_to |
2 D chip designs
|
| gptkbp:is_compatible_with |
gptkb:financial_technology
|
| gptkbp:is_critical_for |
gptkb:cloud_computing
gptkb:machine_learning big data analytics |
| gptkbp:is_discussed_in |
news articles
forums industry conferences technology blogs |
| gptkbp:is_evaluated_by |
gptkb:investors
research papers analysts research firms |
| gptkbp:is_expected_to |
shape future computing architectures
|
| gptkbp:is_explored_in |
patents
technical articles white papers |
| gptkbp:is_influenced_by |
market demands
|
| gptkbp:is_part_of |
gptkb:Intel's_3_D_XPoint_technology
gptkb:Intel's_Optane_technology Intel's technology roadmap Intel's innovation strategy Intel's product portfolio 3 D integration technology |
| gptkbp:is_promoted_by |
Intel's marketing campaigns
|
| gptkbp:is_promoted_through |
tutorials
online courses webinars |
| gptkbp:is_recognized_by |
industry awards
|
| gptkbp:is_related_to |
gptkb:Moore's_Law
|
| gptkbp:is_supported_by |
collaborations with universities
partnerships with research institutions advanced packaging techniques |
| gptkbp:is_used_in |
data centers
high-performance computing AI applications |
| gptkbp:key |
next-generation processors
|
| gptkbp:reduces |
power consumption
|
| gptkbp:used_in |
gptkb:Company
|
| gptkbp:bfsParent |
gptkb:Intel_3_D_XPoint_Technology
gptkb:Intel's_3_D_XPoint_technology |
| gptkbp:bfsLayer |
6
|