gptkbp:instance_of
|
gptkb:microprocessor
|
gptkbp:bfsLayer
|
6
|
gptkbp:bfsParent
|
gptkb:Intel's_10th_generation_family
|
gptkbp:architectural_style
|
x86-64
|
gptkbp:cache_size
|
up to 8 MB
|
gptkbp:code
|
gptkb:Ice_Lake
|
gptkbp:competitors
|
gptkb:AMD_Ryzen_4000_series
|
gptkbp:developed_by
|
gptkb:Intel
|
gptkbp:events
|
gptkb:CES_2020
Intel Architecture Day 2019
|
gptkbp:features
|
gptkb:technology
AI acceleration
|
gptkbp:form_factor
|
gptkb:microprocessor
|
gptkbp:fuel_capacity
|
high
|
gptkbp:graphics
|
gptkb:Intel_Iris_Plus
gptkb:Direct_X_12
|
https://www.w3.org/2000/01/rdf-schema#label
|
Ice Lake-Y
|
gptkbp:hyper_threading
|
up to 8 threads
|
gptkbp:is_compatible_with
|
gptkb:Intel_400_series_chipsets
gptkb:operating_system
|
gptkbp:is_integrated_with
|
gptkb:Intel_Deep_Learning_Boost
|
gptkbp:key
|
better battery life
enhanced graphics performance
improved CPU performance
support for new connectivity standards
|
gptkbp:launch_date
|
gptkb:2020
|
gptkbp:market
|
varies by configuration
premium segment
Q3 2020
|
gptkbp:market_segment
|
mobile computing
|
gptkbp:number_of_cores
|
up to 4 cores
|
gptkbp:performance
|
improved over previous generations
compared to previous generations
up to 1.1 TFLOPS
|
gptkbp:power_consumption
|
improved
low power
|
gptkbp:produced_by
|
gptkb:10nm_Super_Fin
10 nm
|
gptkbp:ram
|
up to 64 GB
DD R4
|
gptkbp:release_date
|
gptkb:2020
|
gptkbp:released
|
Intel's 10th Gen Core processors
|
gptkbp:security_features
|
gptkb:Intel_SGX
|
gptkbp:successor
|
gptkb:Alder_Lake
|
gptkbp:supports
|
gptkb:Thunderbolt_3
gptkb:Wi-Fi_6
|
gptkbp:target_market
|
ultra-portable laptops
|
gptkbp:targets
|
ultra-thin laptops
|
gptkbp:tdp
|
up to 9 W
|
gptkbp:thermal_design_power
|
9 W to 15 W
|
gptkbp:video_output
|
gptkb:HEVC
4 KHDR
V P9
|