|
gptkbp:instance_of
|
gptkb:microprocessor
|
|
gptkbp:bfsLayer
|
5
|
|
gptkbp:bfsParent
|
gptkb:Cray_supercomputers
|
|
gptkbp:application
|
gptkb:software_framework
gptkb:Research_Institute
data analytics
financial modeling
climate modeling
genomics
engineering simulations
|
|
gptkbp:architectural_style
|
gptkb:Cray_architecture
|
|
gptkbp:collaborations
|
academic collaborations
research partnerships
industry partnerships
|
|
gptkbp:connects
|
Slingshot
|
|
gptkbp:cooling_system
|
liquid cooling
|
|
gptkbp:deployment
|
gptkb:2021
|
|
gptkbp:design
|
energy-efficient
|
|
gptkbp:form_factor
|
rack-mounted
|
|
gptkbp:has_programs
|
gptkb:HPE_Cray_Compilers
gptkb:HPE_Cray_Performance_Tools
gptkb:HPE_Cray_Programming_Environment
gptkb:HPE_Cray_System_Software
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
HPE Cray EX
|
|
gptkbp:introduced
|
gptkb:2020
|
|
gptkbp:is_scalable
|
scalable architecture
|
|
gptkbp:manufacturer
|
gptkb:Hewlett_Packard_Enterprise
|
|
gptkbp:market_segment
|
enterprise market
education market
government market
supercomputing market
|
|
gptkbp:network
|
high-speed networking
|
|
gptkbp:notable_feature
|
modular design
|
|
gptkbp:operating_system
|
gptkb:operating_system
|
|
gptkbp:performance
|
gptkb:HPCG_benchmark
up to 1.5 exaflops
TO P500 list
HPL benchmark
|
|
gptkbp:power_consumption
|
up to 30 MW
|
|
gptkbp:project
|
AI acceleration
exascale computing
quantum computing integration
|
|
gptkbp:ram
|
up to 2.5 PB
|
|
gptkbp:storage
|
up to 1.5 PB
|
|
gptkbp:successor
|
gptkb:HPE_Cray_XC_series
|
|
gptkbp:supports
|
HPE support services
|
|
gptkbp:target_market
|
high-performance computing
|
|
gptkbp:user_base
|
universities
government agencies
research institutions
corporate research labs
|