|
gptkbp:instanceOf
|
mainframe computer
|
|
gptkbp:architecture
|
gptkb:ARM_(in_later_models)
x86-64
|
|
gptkbp:countryOfOrigin
|
gptkb:United_States
|
|
gptkbp:feature
|
high bandwidth interconnect
energy efficiency improvements
support for hybrid CPU/GPU nodes
liquid cooling (optional)
scalable modular design
support for large memory nodes
|
|
https://www.w3.org/2000/01/rdf-schema#label
|
Cray XC series
|
|
gptkbp:introduced
|
2012
|
|
gptkbp:manufacturer
|
gptkb:Cray_Inc.
|
|
gptkbp:marketedAs
|
gptkb:Cray_Cascade_(early_name)
|
|
gptkbp:notableInstitution
|
gptkb:Blue_Waters_supercomputer
gptkb:ARCHER_supercomputer
gptkb:Hazel_Hen_supercomputer
gptkb:Cori_supercomputer
gptkb:Piz_Daint
|
|
gptkbp:notableModel
|
gptkb:Cray_XC30
gptkb:Cray_XC40
gptkb:Cray_XC50
|
|
gptkbp:operatingSystem
|
gptkb:Cray_Linux_Environment
|
|
gptkbp:parentCompany
|
Hewlett Packard Enterprise (after 2019)
|
|
gptkbp:predecessor
|
gptkb:Cray_XE_series
|
|
gptkbp:successor
|
gptkb:Cray_Shasta_series
|
|
gptkbp:supportedBy
|
gptkb:NVIDIA_Tesla_GPUs
gptkb:AMD_EPYC_(in_later_models)
gptkb:Intel_Xeon
gptkb:Intel_Xeon_Phi
|
|
gptkbp:supportsInterconnect
|
gptkb:Dragonfly_topology
gptkb:Aries_interconnect
|
|
gptkbp:usedBy
|
gptkb:Oak_Ridge_National_Laboratory
gptkb:National_Energy_Research_Scientific_Computing_Center
gptkb:Swiss_National_Supercomputing_Centre
|
|
gptkbp:usedFor
|
scientific computing
engineering simulations
climate research
weather modeling
|
|
gptkbp:bfsParent
|
gptkb:HPE_Cray_EX
|
|
gptkbp:bfsLayer
|
6
|