Statements (28)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:announced |
2018
|
| gptkbp:application |
gptkb:AI_accelerators
mobile computing client processors |
| gptkbp:competitor |
Samsung X-Cube
TSMC 3DFabric |
| gptkbp:developedBy |
gptkb:Intel
|
| gptkbp:enables |
heterogeneous integration
chiplet architectures 3D stacking of logic chips increased bandwidth between dies mixing different process nodes reduced package footprint vertical power delivery |
| gptkbp:feature |
high-density interconnects
active interposer face-to-face die stacking |
| https://www.w3.org/2000/01/rdf-schema#label |
Foveros 3D packaging
|
| gptkbp:product |
gptkb:Intel_Lakefield
|
| gptkbp:relatedTo |
gptkb:EMIB
chiplet design |
| gptkbp:technology |
3D IC packaging
|
| gptkbp:usedIn |
Meteor Lake processors
Lakefield processors |
| gptkbp:bfsParent |
gptkb:Core_Ultra
gptkb:Intel_Core_Ultra |
| gptkbp:bfsLayer |
6
|