Statements (26)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:technology
|
| gptkbp:announced |
2016
|
| gptkbp:category |
2.5D packaging
|
| gptkbp:compatibleWith |
silicon interposer
|
| gptkbp:competitor |
TSMC CoWoS
TSMC InFO |
| gptkbp:developedBy |
gptkb:Intel
|
| gptkbp:enables |
high bandwidth interconnects
heterogeneous integration high density connections multi-die systems |
| https://www.w3.org/2000/01/rdf-schema#label |
EMIB
|
| gptkbp:standsFor |
Embedded Multi-die Interconnect Bridge
|
| gptkbp:usedFor |
chip packaging
|
| gptkbp:usedIn |
gptkb:Intel_Ponte_Vecchio
gptkb:Intel_Sapphire_Rapids gptkb:Intel_GPUs gptkb:Intel_Xeon_processors gptkb:Intel_FPGAs Intel Stratix 10 Intel Agilex |
| gptkbp:bfsParent |
gptkb:Intel_Ponte_Vecchio
gptkb:Xe-HPC gptkb:Foveros_3D_packaging gptkb:Intel_Xe_HPC_Ponte_Vecchio |
| gptkbp:bfsLayer |
7
|