Statements (24)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
3D packaging technology
|
| gptkbp:allows |
vertical stacking of active silicon layers
|
| gptkbp:announced |
2018
|
| gptkbp:developedBy |
gptkb:Intel
|
| gptkbp:enables |
high bandwidth interconnects
heterogeneous integration power efficiency improvements chiplet architectures customizable SoC designs logic-on-logic stacking mixing of different process nodes reduced footprint for SoCs |
| https://www.w3.org/2000/01/rdf-schema#label |
Foveros
|
| gptkbp:introducedIn |
Lakefield processors
|
| gptkbp:relatedTo |
gptkb:EMIB
chiplet technology |
| gptkbp:usedFor |
gptkb:AI_accelerators
mobile processors client computing |
| gptkbp:usedIn |
gptkb:Alder_Lake_processors
Meteor Lake processors |
| gptkbp:bfsParent |
gptkb:Xe-HPC
gptkb:Intel_Xe_HPC_Ponte_Vecchio |
| gptkbp:bfsLayer |
7
|