Statements (37)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor package type
|
| gptkbp:abbreviation |
gptkb:FCBGA
|
| gptkbp:advantage |
improved electrical performance
improved heat dissipation smaller package size |
| gptkbp:application |
gptkb:consumer_electronics
high-performance computing industrial equipment mobile devices |
| gptkbp:assembly |
reflow soldering
|
| gptkbp:challenge |
difficult rework
voids under die warpage |
| gptkbp:component |
printed circuit boards
|
| gptkbp:connectorType |
direct chip-to-substrate
|
| gptkbp:contrastsWith |
wire-bond BGA
|
| gptkbp:developedBy |
semiconductor industry
|
| gptkbp:feature |
solder balls on underside
good thermal performance high I/O density short electrical path flip-chip die attachment |
| gptkbp:fullName |
Flip-Chip Ball Grid Array
|
| https://www.w3.org/2000/01/rdf-schema#label |
Flip-Chip BGA
|
| gptkbp:inspectionBody |
X-ray inspection
|
| gptkbp:relatedTo |
gptkb:CSP
BGA FC-CSP |
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:substrate |
gptkb:ceramics
organic |
| gptkbp:type |
surface-mount
|
| gptkbp:usedIn |
microprocessors
integrated circuits graphics processing units |
| gptkbp:bfsParent |
gptkb:Stratix_II
|
| gptkbp:bfsLayer |
7
|