Statements (18)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
surface-mount packaging
|
| gptkbp:abbreviation |
gptkb:EBGA
|
| gptkbp:advantage |
better signal integrity
better heat dissipation |
| gptkbp:application |
microprocessors
ASICs FPGAs |
| gptkbp:feature |
improved electrical performance
improved thermal performance smaller package size higher pin count array of solder balls on underside |
| https://www.w3.org/2000/01/rdf-schema#label |
Enhanced Ball Grid Array
|
| gptkbp:relatedTo |
Land Grid Array
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedFor |
integrated circuits
|
| gptkbp:bfsParent |
gptkb:EBGA
|
| gptkbp:bfsLayer |
7
|