Statements (32)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:semiconductor_package
|
| gptkbp:alsoKnownAs |
TO-263
|
| gptkbp:application |
automotive electronics
industrial electronics power management |
| gptkbp:bodyLength |
15.24 mm
|
| gptkbp:feature |
plastic package
low profile suitable for automated assembly high power dissipation large heat sink tab |
| gptkbp:hasTab |
yes
|
| gptkbp:height |
4.57 mm
|
| gptkbp:JEDECNumber |
TO-263
|
| gptkbp:leadCount |
3
5 7 |
| gptkbp:leadPitch |
2.54 mm
|
| gptkbp:predecessor |
gptkb:TO-220
|
| gptkbp:standardizedBy |
gptkb:JEDEC
|
| gptkbp:tabMaterial |
copper
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedFor |
transistors
diodes voltage regulators power semiconductors surface-mount technology |
| gptkbp:width |
10.16 mm
|
| gptkbp:bfsParent |
gptkb:TRENCHSTOP_IGBT
gptkb:IGBT |
| gptkbp:bfsLayer |
7
|
| https://www.w3.org/2000/01/rdf-schema#label |
D2PAK
|