Statements (23)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
semiconductor packaging technology
|
| gptkbp:abbreviation |
gptkb:COB
|
| gptkbp:advantage |
higher component density
improved thermal performance lower cost for high-volume production |
| gptkbp:application |
gptkb:consumer_electronics
industrial equipment automotive lighting display backlighting |
| gptkbp:contrastsWith |
gptkb:Surface_Mount_Technology
Wire Bonding |
| gptkbp:feature |
direct mounting of bare chips on PCB
encapsulation with epoxy or resin |
| https://www.w3.org/2000/01/rdf-schema#label |
Chip on Board
|
| gptkbp:processor |
encapsulation
wire bonding die attachment |
| gptkbp:relatedTo |
gptkb:Multi-Chip_Module
System in Package |
| gptkbp:usedIn |
LED lighting
electronics manufacturing |
| gptkbp:bfsParent |
gptkb:COB
|
| gptkbp:bfsLayer |
7
|