Statements (22)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Integrated Circuit Package
|
| gptkbp:abbreviation |
gptkb:CLCC
|
| gptkbp:alternativeTo |
gptkb:Plastic_Leaded_Chip_Carrier
|
| gptkbp:application |
gptkb:Aerospace_Electronics
Military Electronics High-reliability Electronics |
| gptkbp:feature |
J-leads
Chip Carrier Good Electrical Insulation Good Thermal Conductivity Gull-wing Leads Hermetic Sealing Leaded Multiple Pin Counts Windowed Lid (for UV EPROMs) |
| https://www.w3.org/2000/01/rdf-schema#label |
Ceramic Leaded Chip Carrier
|
| gptkbp:material |
gptkb:ceramics
|
| gptkbp:type |
Surface-mount
Through-hole |
| gptkbp:usedFor |
Integrated Circuits
|
| gptkbp:bfsParent |
gptkb:Plastic_Leaded_Chip_Carrier
|
| gptkbp:bfsLayer |
7
|