Statements (12)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
Land Grid Array
|
| gptkbp:advantage |
high density interconnect
improved thermal performance |
| gptkbp:feature |
surface-mount technology
array of solder balls |
| https://www.w3.org/2000/01/rdf-schema#label |
BGA 1449
|
| gptkbp:pinCount |
1449
|
| gptkbp:type |
BGA
|
| gptkbp:usedFor |
integrated circuits
|
| gptkbp:usedIn |
high pin count devices
|
| gptkbp:bfsParent |
gptkb:Core_i5
|
| gptkbp:bfsLayer |
5
|