BGA 1364

GPTKB entity

Statements (19)
Predicate Object
gptkbp:instanceOf Land Grid Array
gptkbp:application high-performance computing
industrial equipment
telecommunications
gptkbp:feature good thermal performance
high pin density
suitable for high-speed applications
https://www.w3.org/2000/01/rdf-schema#label BGA 1364
gptkbp:mountingMethod reflow soldering
gptkbp:notableCompany gptkb:Intel
gptkb:Xilinx
gptkb:Altera
gptkbp:pinCount 1364
gptkbp:type surface-mount
gptkbp:usedFor integrated circuits
ASICs
FPGAs
gptkbp:bfsParent gptkb:Broadwell
gptkbp:bfsLayer 5