Statements (19)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:Land_Grid_Array
|
| gptkbp:application |
gptkb:industrial_equipment
high-performance computing telecommunications |
| gptkbp:feature |
good thermal performance
high pin density suitable for high-speed applications |
| gptkbp:mountingMethod |
reflow soldering
|
| gptkbp:notableCompany |
gptkb:Intel
gptkb:Xilinx gptkb:Altera |
| gptkbp:pinCount |
1364
|
| gptkbp:type |
surface-mount
|
| gptkbp:usedFor |
integrated circuits
ASICs FPGAs |
| gptkbp:bfsParent |
gptkb:Broadwell
|
| gptkbp:bfsLayer |
6
|
| https://www.w3.org/2000/01/rdf-schema#label |
BGA 1364
|