Statements (17)
| Predicate | Object |
|---|---|
| gptkbp:instanceOf |
gptkb:microprocessor
|
| gptkbp:advantage |
improved electrical performance
better heat dissipation |
| gptkbp:feature |
small footprint
surface-mount technology high pin density |
| https://www.w3.org/2000/01/rdf-schema#label |
BGA217
|
| gptkbp:pieceCount |
217
|
| gptkbp:type |
gptkb:Ball_Grid_Array_(BGA)
|
| gptkbp:usedFor |
semiconductor devices
|
| gptkbp:usedIn |
mobile devices
memory chips processors |
| gptkbp:bfsParent |
gptkb:SAM9260
gptkb:SAM9G20 gptkb:SAM9X60 |
| gptkbp:bfsLayer |
7
|