Statements (102)
Predicate | Object |
---|---|
gptkbp:instance_of |
gptkb:microprocessor
|
gptkbp:architecture |
x86-64
|
gptkbp:cache_size |
up to 256 MB L3 cache
|
gptkbp:compatibility |
gptkb:Windows_Server
gptkb:Linux |
gptkbp:competitors |
gptkb:Intel_Xeon
|
gptkbp:cooling_system |
advanced cooling solutions
|
gptkbp:customer_base |
gptkb:financial_institutions
government agencies cloud service providers large enterprises telecommunications companies |
gptkbp:design |
multi-chip module design
|
gptkbp:ecological_role |
strong ecosystem support
|
gptkbp:features |
support for multi-threading
support for PCIe 4.0 support for high bandwidth memory support for advanced power management support for 2nd Gen Infinity Architecture support for 8-channel memory support for AMD Infinity Fabric support for AMD Memory Guard support for AMD Ryzen technology support for AMD Secure Processor support for NUMA architecture support for RDIMM and LRDIMM support for error-correcting code (ECC) memory support for memory mirroring support for memory sparing support for up to 8 sockets support for 128 PCIe lanes |
gptkbp:first_generation |
third generation
|
gptkbp:first_released |
gptkb:2017
June 2017 |
gptkbp:fuel_economy |
high power efficiency
|
gptkbp:graphics |
gptkb:none
|
https://www.w3.org/2000/01/rdf-schema#label |
AMD EPYC processors
|
gptkbp:hyper_threading |
supported
up to 128 threads up to 128 |
gptkbp:is_scalable |
high scalability for workloads
|
gptkbp:latest_version |
gptkb:AMD_EPYC_7004_series
|
gptkbp:launch_date |
March 2021
|
gptkbp:launch_event |
gptkb:Computex_2017
|
gptkbp:manufacturer |
gptkb:AMD
|
gptkbp:manufacturing_process |
7 nm
|
gptkbp:market_position |
challenger to Intel
|
gptkbp:market_share |
growing
|
gptkbp:memory_type |
DDR4
up to 4 TB |
gptkbp:number_of_cores |
up to 64 cores
up to 64 |
gptkbp:partnerships |
collaborations with major cloud providers
|
gptkbp:pciexpress_version |
up to 128 PCIe lanes
up to 128 |
gptkbp:performance |
energy efficiency
high performance low latency high throughput high memory bandwidth high performance for data centers competitive with Intel Xeon |
gptkbp:power_consumption |
up to 280 W
|
gptkbp:ram |
up to 4 TB
|
gptkbp:release_date |
August 2017
|
gptkbp:security_features |
gptkb:Secure_Encrypted_Virtualization_(SEV)
gptkb:Secure_Memory_Encryption Secure Encrypted Virtualization |
gptkbp:sister_channel |
8 memory channels
|
gptkbp:slisupport |
supported
|
gptkbp:socket_type |
SP3
|
gptkbp:successor |
gptkb:AMD_EPYC_7002_series
gptkb:AMD_EPYC_7003_series |
gptkbp:support |
gptkb:AMD_ROCm
gptkb:AMD_Infinity_Fabric gptkb:AMD_EPYC_7003_series gptkb:AMD_EPYC_7004_series |
gptkbp:target_market |
gptkb:servers
|
gptkbp:tdp |
up to 280 W
|
gptkbp:trends |
growing interest in cloud solutions
increasing adoption in enterprise shift towards ARM and x86 architectures. |
gptkbp:tuning |
optimized for various workloads
|
gptkbp:use_case |
gptkb:blockchain_technology
gptkb:Artificial_Intelligence gptkb:cloud_computing gptkb:machine_learning enterprise applications data centers database management high-performance computing virtualization web hosting big data analytics |
gptkbp:virtualization_support |
gptkb:AMD-V
supported |
gptkbp:bfsParent |
gptkb:Intel's_server_processors
gptkb:Infinity_Fabric gptkb:Intel_Xeon_processors gptkb:HP_Pro_Liant gptkb:Dell_EMC_Power_Edge |
gptkbp:bfsLayer |
5
|